.Materials and Process Development in ITRI Pilot Line
.Advanced Substrate Platform
.Research Center Construction
.Data Bank and Localization
2023 | 2023-2025 | 2026-2028 |
High-Performance Substrate |
Advanced Packaging Integration |
Large-Scale Integration Platform |
.總召集人:欣興電子 陳裕華 副總經理
.副召集人:工研院 蕭志誠 經理
.聯盟例會:每年 2 次
.SIG 會議:待定
Time | Action Item | Expected Output |
2023/12/31 | PPT Report | |