TWGTechnical Working Group

TWGTechnical Working Group

Substrate , Material and Equipment

 

任務目標


Materials and Process Development in ITRI Pilot Line

Advanced Substrate Platform

Research Center Construction

Data Bank and Localization

 

研發規劃


2023 2023-2025 2026-2028

High-Performance

Substrate

Advanced Packaging

Integration

Large-Scale

Integration Platform

 

SIG 成員


.總召集人:欣興電子 陳裕華 副總經理

副召集人:工研院 蕭志誠 經理

 

運作機制


.聯盟例會:每年 2 次

.SIG 會議:待定

 

2023 預計產出


Time Action Item Expected Output
2023/12/31   PPT Report