Advanced Packaging Driving New Collaboration Across Supply Chain
- 發佈日期 : 2024-10-25
- 資料來源：https://semiengineering.com/advanced-packaging-driving-new-collaboration-across-supply-chain/
- 瀏覽人次：54
Rising complexity is changing the way companies engage and interact, but long-standing barriers in communication, culture, and IP protection are slowing progress.
The semiconductor industry is undergoing a profound shift in packaging technologies to ones that rely on close collaboration among multiple stakeholders to solve intricate, multi-faceted, and extraordinarily complex problems.
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