2026 Q2 核心會員會議
- 發佈日期 : 2026-07-06
- 資料來源：Hi-CHIP 異質整合系統級封裝開發聯盟
- 瀏覽人次：9
- 活動日期
- 2026/6/18(四)｜09:30~13:30
- 活動地點
- 新竹喜來登東館 3 樓宴會 1 廳
- 指導單位
- Hi-CHIP 聯盟
Building on the momentum from our first quarter, this meeting will delve into the latest Advanced Packaging market trends and the critical role of AI-driven Memory technology. We will also touch upon the emerging requirements for Quantum Computing infrastructure, exploring how these converging technologies are shaping the next generation of high-performance computing through advanced back-end solutions.
This is a valuable opportunity to stay updated on critical technical breakthroughs and connect with industry peers across the supply chain.
Meeting Information
Date: Thursday, June 18, 2026
Time: 09:30–13:30 (Registration starts at 09:00)
Venue: Grand Ballroom 1, 3rd Floor, East Wing, Sheraton Hsinchu Hotel
Language: English
Agenda:
|
Time |
Session |
|
09:00-09:30 |
Registration |
|
09:30-09:35 |
Opening Remarks |
|
09:35-10:05 |
Advanced Packaging Market and Technology Trends |
|
10:05-10:35 |
Memory Technology Powering the AI Revolution |
|
10:35-11:05 |
Break |
|
11:05-11:35 |
Quantum packaging and the planning of 12-inch advanced semiconductor back-end pilot line |
|
11:35-11:40 |
Closing Remarks |
|
11:40-13:30 |
Lunch |
