2025 Q3 核心會員會議
- 發佈日期 : 2025-09-02
- 資料來源：Hi-CHIP 異質整合系統級封裝開發聯盟
- 瀏覽人次：31
- 活動日期
- 2025/8/27(三)｜09:00~13:30
- 活動地點
- 新竹喜來登東館 3 樓宴會 1 廳
- 主辦單位
- Hi-CHIP 聯盟
To help members stay up to date with the latest industry trends, we warmly invite you to join the upcoming Hi-CHIP Q3 Meeting on Wednesday, August 27, 2025. This session will focus on Glass Solutions, featuring talks from leading experts in the field.
We hope this meeting will provide a great opportunity for multi-party exchange and discussion, fostering collaboration across the industry.
Meeting Details:
- Title: Hi-CHIP Alliance - 2025 Q3 Core Member Meeting
- Date: Wednesday, August 27, 2025
- Time: 09:00–13:30
- Venue: Grand Ballroom 1, 3rd Floor, East Wing, Sheraton Hsinchu Hotel
- Language: English
|
Time |
Session |
|
08:30-09:00 |
Registration |
|
09:00-09:05 |
Opening Remarks |
|
09:05-09:20 |
Secretariat Update and Leadership Transition |
|
09:20-09:45 |
Examination of Panel-Level Manufacturing Methods for Glass Core Substrates |
|
09:45-10:10 |
[Remote] Integrating Glass Solutions in Advanced Packaging |
|
10:10-10:35 |
Large-Scale Glass Core Substrates for High-Performance Computing Applications |
|
10:35-10:50 |
Break |
|
10:50-11:15 |
From Sand to Silicon—and Now to Glass: The Evolution of Chip Packaging |
|
11:15-11:35 |
Panel Discussion: Glass Core Technologies |
|
11:35-11:55 |
Joint Paper Proposal Updates |
|
11:55-12:00 |
Closing Remarks |
|
12:00-13:30 |
Lunch |
