Hi-CHIP 異質整合系統級封裝開發聯盟

To support our members in staying abreast of key technology trends, Hi-CHIP is pleased to host a special technical lecture presented by Intel on the future of chiplet integration and open interconnect standards.

We have invited Dr. Debendra Das Sharma, Intel Senior Fellow and Chair of the UCIe Consortium, to share insights on the latest developments in Universal Chiplet Interconnect Express (UCIe) — a rapidly adopted industry standard enabling plug-and-play chiplet ecosystems for next-generation computing.

Event Information

l   Date: August 7, 2025 (Thursday)

l   Time: 09:00–11:00 AM

l   Venue: Room 3A, 3rd Floor, No. 195, Sec. 4, Chung Hsing Rd., Chutung, Hsinchu, Taiwan (ITRI Chung Hsing Campus)

l   Topic: Innovations with Plug-and-Play Chiplets for Next Generation Computing using Universal Chiplet Interconnect Express (UCIe)

l   Speaker: Dr. Debendra Das Sharma, Intel Senior Fellow / Chair of the UCIe Consortium

l   Language: English