Hi-CHIP 異質整合系統級封裝開發聯盟

Topic: System on Module on Glass Substrate (SoMoG)

Abstract

- why considering glass
- the system on module on glass (SoMoG)
- how the electrical property of the SoMoG behaves
- how the mechanical warpage of the SoMoG performs
- how the thermal dissipation of the SoMoG achieves
- key process challenges to be identified and solved

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Topic: Insights from TGV Interposer Process Development

Abstract

In this talk, we share how the Hi-CHIP Alliance, together with our industry partners, embarked on an accelerated effort to explore glass interposer process integration within a three-month timeframe. By coordinating across multiple companies, we combined expertise and resources to investigate some of the most demanding challenges in advanced packaging.
The presentation will guide the audience through critical process modules—such as precision TGV drilling and wet etching, deposition of Ti/Cu seed layers using advanced PVD, and copper filling strategies with electroplating chemistry. Along the way, we will highlight key technical observations, integration sensitivities, and lessons learned that are highly relevant to manufacturability and reliability.
Rather than focusing on final hardware, this session emphasizes insights gained from tackling real-world hurdles and aligning multi-company collaboration toward common goals. These experiences not only deepen understanding of glass interposer technology but also provide guidance for future development paths in advanced packaging.

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Topic: Trend, Opportunity & Challenge for Glass core substrate

Abstract

Substrate warpage and metal junction are key factors in assembling advanced heterogeneously integrated products. Glass cores can provide dimensional stability, and Cu-Cu direct bonding has the potential to improve power/signal integrity. In this talk, we share our exploration of the Glass Interposer M2M-bonded Core, focusing on design considerations, process flow, and key technical insights gained from integration efforts.

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Topic: Next Generation Interconnection by Glass Core Substrate (System on Module with Glass)

Abstract

Glass core substrate (GCS) technology is emerging as a promising solution for high-density interconnection in advanced packaging. Its inherent advantages such as low dielectric loss, high dimensional stability, and mechanical robustness make it suitable for next-generation electronic systems. A key challenge in GCS fabrication is the reliable formation and filling of Through Glass Vias (TGVs), which require precise control over via drilling, metallization, and dielectric filling. This study demonstrates a panel-level process for building a GCS test vehicle (TV) with dual-side redistribution layers (RDLs). The structure includes six RDL layers and six dielectric layers on a 200 mm × 200 mm glass panel with 400 µm thickness. The TGVs were metallized using conformal copper plating, and the via centers were filled with a vacuum-laminated photo-imageable dielectric. Fine-line patterning was achieved using a dry semi-additive process with a minimum line/space of 10/10 µm. The results confirm the feasibility of integrating materials and processes for scalable glass-based packaging.