Integration Hurdles For Analog And RF In Next-Gen Packages
- 發佈日期 : 2024-05-30
- 資料來源：Semiconductor Engineering
- 瀏覽人次：17
Strategies and advancements for thermal dissipation, shielding, and testing schemes.
A rapid increase in wireless connectivity and more sensors, coupled with a shift away from monolithic SoCs toward heterogeneous integration, is driving up the amount of analog/RF content in systems and changing the dynamics within a package.
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