Glass Substrates Gain Foothold In Advanced Packages
- 發佈日期 : 2024-01-10
- 資料來源：Semiconductor Engineering
- 瀏覽人次：59
Problems need to be solved before this technology goes mainstream, but the benefits are significant.
Glass substrates are starting to gain traction in advanced packages, fueled by the potential for denser routing and higher signal performance than the organic substrates used today.
詳見內文，請點選連結：【Glass Substrates Gain Foothold In Advanced Packages】