Precise Control Needed For Copper Plating And CMP
- 發佈日期 : 2024-06-21
- 資料來源：Semiconductor Engineering
- 瀏覽人次：20
The more complex the CMP processes, the more data they have to work with, and the bigger the gains from adopting machine learning.
Chipmakers are relying on machine learning for electroplating and wafer cleaning at leading-edge process nodes, augmenting traditional fault detection/classification and statistical process control in order to extend the usefulness of copper interconnects.
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