Single Vs. Multi-Patterning Advancements For EUV
- 發佈日期 : 2024-06-26
- 資料來源：Semiconductor Engineering
- 瀏覽人次：67
EUV patterning has come a long way in the past five years, but old challenges resurface with high-NA EUV.
As semiconductor devices become more complex, so do the methods for patterning them. Ever-smaller features at each new node require continuous advancements in photolithography techniques and technologies.
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