Hi-CHIP 異質整合系統級封裝開發聯盟

EUV patterning has come a long way in the past five years, but old challenges resurface with high-NA EUV.

As semiconductor devices become more complex, so do the methods for patterning them. Ever-smaller features at each new node require continuous advancements in photolithography techniques and technologies.

詳見內文，請點選連結：【Single Vs. Multi-Patterning Advancements For EUV】