Controlling Warpage In Advanced Packages
- 發佈日期 : 2024-06-26
- 資料來源：Semiconductor Engineering
- 瀏覽人次：67
Mechanical stresses increase with larger sizes and heterogeneous materials.
Warpage is becoming a serious concern in advanced packaging, where a heterogeneous mix of materials can cause uneven stress points during assembly and packaging, and under real workloads in the field.
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