Heat-Related Issues Impact Reliability In Advanced IC Designs
- 發佈日期 : 2024-07-22
- 資料來源：Semiconductor Engineering
- 瀏覽人次：23
Retaining data in memories and processors becomes more difficult as temperatures rise in advanced packages and under heavy workloads.
Heat is becoming a much bigger problem in advanced-node chips and packages, causing critical electrons to leak out of DRAM, timing and reliability issues in 3D-ICs, and accelerated aging that are unique to different workloads.
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