3D-ICs May Be The Least-Cost Option
- 發佈日期 : 2023-11-30
- 資料來源：Semiconductor Engineering
- 瀏覽人次：66
Advanced packaging has evolved from expensive custom solutions to those ready for more widespread adoption.
When 2.5D and 3D packaging were first conceived, the general consensus was that only the largest semiconductor houses would be able to afford them, but development costs are quickly coming under control. In some cases, these advanced packages actually may turn out to be the lowest-cost options.
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