2026 Q1 核心會員會議
- 發佈日期 : 2026-03-27
- 資料來源：Hi-CHIP 異質整合系統級封裝開發聯盟
- 瀏覽人次：3
- 活動日期
- 2026/3/19(四)｜09:30~13:30
- 活動地點
- 新竹喜來登東館 3 樓宴會 1 廳
- 指導單位
- Hi-CHIP 聯盟
The meeting will feature invited talks on advanced semiconductor packaging technologies and market trends, focusing on AI-driven demand and next-generation packaging solutions.
Members will gain timely insights from both market and technology perspectives, and have the opportunity to connect with fellow alliance members.
Meeting Details:
Date: Thursday, March 19, 2026
Time: 09:30–13:30
Venue: Grand Ballroom 1, 3rd Floor, East Wing, Sheraton Hsinchu Hotel
Language: English
Agenda:
|
Time |
Session |
|
09:00-09:30 |
Registration |
|
09:30-09:35 |
Opening Remarks |
|
09:35-10:05 |
Advanced Semiconductor Packaging Trend for AI Market |
|
10:05-10:35 |
Building a Robust Ecosystem: Trends and Requirements for 3DFabric® Technologies |
|
10:35-11:05 |
Break |
|
11:05-11:35 |
Next Generation Advanced Packaging Technologies for Futuristic AI ASICs |
|
11:35-11:40 |
Alliance Progress and Plans |
|
11:40-11:45 |
Closing Remarks |
|
11:45-13:30 |
Lunch |
