Hi-CHIP 異質整合系統級封裝開發聯盟

Coming In Hot: Requirements For Successful Thermal Management In 3D-IC

• 發佈日期 : 2022-10-05
• 資料來源：https://semiengineering.com/coming-in-hot-requirements-for-successful-thermal-management-in-3d-ic/
• 瀏覽人次：78