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2024/03/27 Hi-CHIP 核心會員會議

  • 發佈日期 : 2024-03-27
  • 資料來源:Hi-CHIP 異質整合系統級封裝開發聯盟
  • 瀏覽人次:91
活動日期
2024/3/27(三)|09:00~13:00
活動地點
新竹喜來登東館 3 樓宴會 1 廳
主辦單位
Hi-CHIP 聯盟

本次會議旨在與會員共同討論新一年度的聯盟計劃,並邀請了創意電子徐仁泰副總經理、Ajinomoto  Fujishima 博士 與 EVG 李昱瑩處長分享專題。

 

我們期望透過與產業先進的深入交流,協助各位會員更全面地了解生成式 AI 運算模組的高速介面需求與市場挑戰,在激烈競爭的環境中搶先布局。

 

Time Session
09:00-09:05 Opening
Speaker: Shih-Chieh Chang, Chairman of  Hi-CHIP and General Director of EOSL, ITRI
09:05-09:15 Secretariat Report
Speaker: Jerry Wang, General Secretary of  Hi-CHIP and Division Director of EOSL, ITRI
09:15-09:45 Technical Working Group Report
Speaker:
General Convener of TWG 1: Li-Cheng Shen, Senior Director, USI
General Convener of TWG 2: Johnson Tai, President, Raytek
General Convener of TWG 3: Yu-Hua Chen, Vice President, Unimicron  
09:45-10:15 Topic: AI and Advanced Packaging Technology and D2D:  UCIe 2.5D vs. UCIe 3D
Speaker: Jen-Tai Hsu, VP of IP R&D, GUC 
10:15-10:30 Break
10:30-11:00 Topic: Novel Insulation Materials for High Performance Computing Applications
Speaker: Shohei Fujishima, Ph. D., Ajinomoto
11:00-11:30 Topic: Future Trend for Ultra Low Temperature Cu/Oxide and Cu/Polymer Hybrid Bonding
Speaker: Cindy Lee, Technology Director, EVG Taiwan 
11:30-12:00 Discussion
12:00-13:00 Lunch

 

 

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