2024/03/27 Hi-CHIP 核心會員會議
- 發佈日期 : 2024-03-27
- 資料來源：Hi-CHIP 異質整合系統級封裝開發聯盟
- 瀏覽人次：121
- 活動日期
- 2024/3/27(三)｜09:00~13:00
- 活動地點
- 新竹喜來登東館 3 樓宴會 1 廳
- 主辦單位
- Hi-CHIP 聯盟
本次會議旨在與會員共同討論新一年度的聯盟計劃，並邀請了創意電子徐仁泰副總經理、Ajinomoto Fujishima 博士 與 EVG 李昱瑩處長分享專題。
我們期望透過與產業先進的深入交流，協助各位會員更全面地了解生成式 AI 運算模組的高速介面需求與市場挑戰，在激烈競爭的環境中搶先布局。
| Time | Session |
| 09:00-09:05 | Opening Speaker: Shih-Chieh Chang, Chairman of Hi-CHIP and General Director of EOSL, ITRI |
| 09:05-09:15 | Secretariat Report Speaker: Jerry Wang, General Secretary of Hi-CHIP and Division Director of EOSL, ITRI |
| 09:15-09:45 | Technical Working Group Report Speaker: General Convener of TWG 1: Li-Cheng Shen, Senior Director, USI General Convener of TWG 2: Johnson Tai, President, Raytek General Convener of TWG 3: Yu-Hua Chen, Vice President, Unimicron |
| 09:45-10:15 | Topic: AI and Advanced Packaging Technology and D2D: UCIe 2.5D vs. UCIe 3D Speaker: Jen-Tai Hsu, VP of IP R&D, GUC |
| 10:15-10:30 | Break |
| 10:30-11:00 | Topic: Novel Insulation Materials for High Performance Computing Applications Speaker: Shohei Fujishima, Ph. D., Ajinomoto |
| 11:00-11:30 | Topic: Future Trend for Ultra Low Temperature Cu/Oxide and Cu/Polymer Hybrid Bonding Speaker: Cindy Lee, Technology Director, EVG Taiwan |
| 11:30-12:00 | Discussion |
| 12:00-13:00 | Lunch |
