Electromigration Concerns Grow In Advanced Packages
- 發佈日期 : 2024-04-23
- 資料來源：Semiconductor Engineering
- 瀏覽人次：63
Higher density, heat, and more materials make it harder to ensure reliability.
The incessant demand for more speed in chips requires forcing more energy through ever-smaller devices, increasing current density and threatening long-term chip reliability. While this problem is well understood, it’s becoming more difficult to contain in leading-edge designs.
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