UCIe Goes Back To The Drawing Board
- 發佈日期 : 2024-02-26
- 資料來源：Semiconductor Engineering
- 瀏覽人次：71
The open chiplet interconnect protocol faces some formidable challenges, but progress continues.
The integration of multiple dies within a single package increasingly is viewed as the next evolution for extending Moore’s Law, but it also presents myriad challenges — particularly in achieving a universally accepted standard integrating plug-and-play chiplets from different vendors.
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