Fabs Begin Ramping Up Machine Learning
- 發佈日期 : 2023-12-20
- 資料來源：Semiconductor Engineering
- 瀏覽人次：50
New models can debug processes and boost yield, but there are lots of caveats.
Fabs are beginning to deploy machine learning models to drill deep into complex processes, leveraging both vast compute power and significant advances in ML. All of this is necessary as dimensions shrink and complexity increases with new materials and structures, processes, and packaging options, and as demand for reliability increases.
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