Data Center Thermal Management Improves
- 發佈日期 : 2024-07-22
- 資料來源：Semiconductor Engineering
- 瀏覽人次：19
CFD, multiphysics, and digital twins play increasing role in addressing heat within and between server racks.
Thermal issues are plaguing semiconductor design at every level, from chips developed with single-digit nanometer processes to 100,000-square-foot data centers. The underlying cause is too many devices or services that require increasing amounts of power, and too few opportunities for the resulting heat to dissipate.
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