Data Center Thermal Management Improves
- 發佈日期 : 2024-07-22
- 資料來源：Semiconductor Engineering
- 瀏覽人次：113
CFD, multiphysics, and digital twins play increasing role in addressing heat within and between server racks.
Thermal issues are plaguing semiconductor design at every level, from chips developed with single-digit nanometer processes to 100,000-square-foot data centers. The underlying cause is too many devices or services that require increasing amounts of power, and too few opportunities for the resulting heat to dissipate.
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