Hi-CHIP 異質整合系統級封裝開發聯盟

Intel Is All-In on Backside Power Delivery The company’s PowerVia interconnect tech demonstrated a 6 percent performance gain

• 發佈日期 : 2023-06-09
• 資料來源：https://spectrum.ieee.org/backside-power-delivery
• 瀏覽人次：85