Fan-Out Panel-Level Packaging Hurdles
- 發佈日期 : 2024-01-25
- 資料來源：Semiconductor Engineering
- 瀏覽人次：59
The economics look attractive, but first the industry needs convergence on panel size, process tools, and materials.
Fan-out panel-level packaging (FOPLP) promises to significantly lower assembly costs over fan-out wafer-level packaging, providing the relevant processes for die placement, molding and redistribution layers (RDLs) formation can be scaled up with equivalent yield.
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