Using Real Workloads To Assess Thermal Impacts
- 發佈日期 : 2023-12-15
- 資料來源：Semiconductor Engineering
- 瀏覽人次：51
A number of methods and tools can be used to determine how a device will react under thermal constraints.
Thermal analysis is being driven much further left in the design, fueled by demand for increased transistor density and more features on a chip or in a package, as well as the unique ways the various components may be exercised or stressed.
詳見內文，請點選連結：【Using Real Workloads To Assess Thermal Impacts】