Design Flow Challenged By 3D-IC Process, Thermal Variation
- 發佈日期 : 2024-07-08
- 資料來源：Semiconductor Engineering
- 瀏覽人次：23
Rethinking traditional workflows by shifting left can help solve persistent problems caused by process and thermal variations.
3D-ICs are proving a challenge even for designers accustomed to dealing with power and performance tradeoffs, but they are considered an inevitable migration path for leading-edge designs due to the compute demands of AI and the continual shrinking of digital logic.
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