Heterogeneous Integration and Chiplet System Package Alliance
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Technical Working Group
Intelligent System
Missions
．Chiplet Interface Design
．Design for Harsh Environment
．High Cooling Material and Design
R&D Planning
| 2023 | 2023-2025 | 2026-2028 |
|
Low Power Edge Computing Device |
Smart Cockpit and AR/VR Platform |
Intelligent UAV Platform |
Members of SIGs
．General Convener：Li-Cheng Shen, Director, USI
· Deputy Convener：Ming-Ji Dai, Deputy R&D Director, ITRI
Randy Wu, Manager, ITRI
Liang-Hsuan Tai, Manager, ITRI
Operation Mechanism
．Regular meeting：2 times a year
Projected output in 2023
| Time | Action Item | Expected Output |
| 2023/12/31 |
Enable AI Chip in Drone | PPT Report |
|
Renesas R-Car M3 SOM Platform Development
|
Triple-screen output for Smart Cockpit
· Design example of p electronic digital instrument panel · Design example of p car infotainment system · Design example of p car navigation |
|
|
Construction and integration of Crank Storyboard 3D Model*3
|