Technical Working Group

Technical Working Group

Intelligent System

 

Missions


.Chiplet Interface Design

.Design for Harsh Environment

.High Cooling Material and Design

 

 

R&D Planning


2023 2023-2025 2026-2028

Low Power Edge

Computing Device

Smart Cockpit

and AR/VR Platform

Intelligent

UAV Platform

 

 

Members of SIGs


.General Convener:Li-Cheng Shen, AVP, USI

 ·  Deputy Convener:Randy Wu, Deputy R&D Director, ITRI

                   

Operation Mechanism


.Regular meeting:2 times a year