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About Hi-CHIP

About
Hi-CHIP

Vice Chairmen

 

 

Dr. Wei-Chung Lo

 

| Education

•  Ph.D./M.S., Department of Chemistry, National Taiwan University

•  Wharton school AMP＋ 2010 (USA)

 

| Experience

•  Deputy General Director, EOSL, ITRI

• President (2021~), executive director of Taiwan International Microelectronics and Assembly Association (IMAPS Taiwan)

•  Secretary of Taiwan Artificial Intelligence Chip Alliance (AITA)

•  Secretary General of 3D IC/Panel Fan-Out Alliance (Ad-STAC)

•  Director, Advanced Microsystems and Architecture Alliance (AMPA)

•  2009/2015/2018 Technical Committee Chairman of Asia's Largest Electronic Packaging IMPACT Conference (IEEE, IMAPS, TPCA)

• Chairman of the Interconnect technical committee and subcommittee of the world's largest electronic packaging ECTC conference (IEEE-EPS, USA)

• Japan ICEP International Technical Committee, SEMI Taiwan Packaging and Testing Committee, TPCA Consultant/Technical Committee

 

| Honors

•  2022 International Semiconductor Industry Association (SEMI) "SEMI Industry Contribution Award"

•  2021 Chinese Association of Engineers "Outstanding Engineer Award" (Electrical Unit)

•  2018 "The Thirty-Sixth National Outstanding Manager Award" by the China Enterprise Economic Association (R&D Category-Individual Award)

•  2016, 2018 ITRI "Industrialization Contribution Award" x2 and "Outstanding Research Award"

•  2016-2020 Industrialization Contribution Award x2, Service Promotion x2, Outstanding Research Award x3

•  2015 National Industry Innovation Award - Innovation Elite Award (individual group)

• 2013 won the "Special Science and Technology Contribution Award" issued by the Ministry of Economic Affairs (individual group)

•  2013 ITRI Promotion Service Gold Medal / 2014 Outstanding Research Award: ITRI Elite

•  2003 won the "Social Outstanding Youth Representative" award