Integration Hurdles For Analog And RF In Next-Gen Packages
- Date : 2024-05-30
- Source：Semiconductor Engineering
- Views ：49
Strategies and advancements for thermal dissipation, shielding, and testing schemes.
A rapid increase in wireless connectivity and more sensors, coupled with a shift away from monolithic SoCs toward heterogeneous integration, is driving up the amount of analog/RF content in systems and changing the dynamics within a package.
For more details, please follow the link below：【Integration Hurdles For Analog And RF In Next-Gen Packages】