Heterogeneous Integration and Chiplet System Package Alliance

Packages are becoming more complex to endure high power, high temperature conditions across a variety of applications.

The power semiconductor market is poised for remarkable growth in the next several years, fueled by the adoption of electric vehicles and renewable energy, but it also driving big changes in the packaging needed to protect and connect these devices.

For more details, please follow the link below：【Big Shifts In Power Electronics Packaging】