Heterogeneous Integration and Chiplet System Package Alliance

A number of methods and tools can be used to determine how a device will react under thermal constraints.

Thermal analysis is being driven much further left in the design, fueled by demand for increased transistor density and more features on a chip or in a package, as well as the unique ways the various components may be exercised or stressed.

For more details, please follow the link below：【Using Real Workloads To Assess Thermal Impacts】