Heterogeneous Integration and Chiplet System Package Alliance

EUV patterning has come a long way in the past five years, but old challenges resurface with high-NA EUV.

As semiconductor devices become more complex, so do the methods for patterning them. Ever-smaller features at each new node require continuous advancements in photolithography techniques and technologies.

For more details, please follow the link below：【Single Vs. Multi-Patterning Advancements For EUV】