Fan-Out Panel-Level Packaging Hurdles
- Date : 2024-01-25
- Source：Semiconductor Engineering
- Views ：97
The economics look attractive, but first the industry needs convergence on panel size, process tools, and materials.
Fan-out panel-level packaging (FOPLP) promises to significantly lower assembly costs over fan-out wafer-level packaging, providing the relevant processes for die placement, molding and redistribution layers (RDLs) formation can be scaled up with equivalent yield.
For more details, please follow the link below：【Fan-Out Panel-Level Packaging Hurdles】