Heterogeneous Integration and Chiplet System Package Alliance

Higher density, heat, and more materials make it harder to ensure reliability.

The incessant demand for more speed in chips requires forcing more energy through ever-smaller devices, increasing current density and threatening long-term chip reliability. While this problem is well understood, it’s becoming more difficult to contain in leading-edge designs.

For more details, please follow the link below：【Electromigration Concerns Grow In Advanced Packages】