2025 Q2 Core Member Meeting
- Date : 2025-05-22
- Source：Heterogeneous Integration and Chiplet System Package Alliance
- Views ：27
- Event date
- May 15, 2025, 09:30-13:30
- Event Location
- Apollo III, B1, Leith Castle, Lakeshore Hotel Hsinchu
- Organizer
- Hi-CHIP Alliance
l Date: May 15, 2025 (Thursday)
l Time: 09:30–13:30
l Venue: Apollo III, B1, Leith Castle, Lakeshore Hotel Hsinchu
l Purpose: Announcement of Elected TWG Conveners and Market Trends Discussion
l Language: English
l Agenda:
| Time | Session |
| 09:00-09:30 | Registration |
| 09:30-09:35 | Opening Remarks Wei-Chung Lo, Vice Chairman of Hi-CHIP |
| 09:35-09:45 | TWG Convener Election Results Announcement |
| 09:45-10:20 | Parallel Sessions 1. Apollo III: ITRI Technical Insights – Advanced Fan-Out Embedded Chip Process Integration for 3D Application Feng-Hsiang Lo, Deputy R&D Director, ITRI 2. Apollo II: Joint Paper Proposal Discussion (for participating group members only) |
| 10:20-10:45 | Break |
| 10:45-11:20 (Including 5-min Q&A) |
Evolution of Chiplet packaging architectures advancing AI and HPC growth Daniel Ng, Fellow, AMD |
| 11:20-11:55 (Including 5-min Q&A) |
Standardize on the Open Chiplet Architecture Frank Chen, Sr. Principal Engineering Leader, Tenstorrent |
| 11:55-12:00 | Closing Remarks Wei-Chung Lo, Vice Chairman of Hi-CHIP |
| 12:00-13:30 | Lunch |
