Heterogeneous Integration and Chiplet System Package Alliance

Time

Session

09:00-09:30

Registration

09:30-09:35

Opening Remarks​​​​
Shih-Chieh Chang, Chairman of Hi-CHIP

09:35-10:00
(Including 5-min Q&A)

Advanced Semiconductor Package for Automotive
Takashi Matsumoto, Project Director of Technology Planning Division, DENSO

10:00-10:25
(Including 5-min Q&A)

Semiconductor Packaging Technologies and Challenges
Shin-Puu Jeng, VP of Technology Heterogeneous Integration, AMAT

10:25-10:55

Break

10:55-11:20
(Including 5-min Q&A)

Next Si Bridge Packaging Technology and Challenges
Yu-Po Wang, Vice President, SPIL

11:20-11:55

Hi-CHIP Annual Plan in 2025
Amanda Wang, Executive Secretary of Hi-CHIP

11:55-12:00

Closing Remarks
Shih-Chieh Chang, Chairman of Hi-CHIP

12:00-13:30

Lunch