Heterogeneous Integration and Chiplet System Package Alliance

This annual gathering is a wonderful opportunity for all alliance members to come together, reconnect, and celebrate our shared achievements over the past year.

This year’s session will feature insightful talks on advanced packaging technologies, including AI infrastructure, FOPLP solutions, and leading-edge exposure technologies, offering members valuable perspectives on the latest trends and innovations shaping our industry.

Meeting Details:

Title: Hi-CHIP Annual Members Gathering 2025

Date: Wednesday, December 3, 2025

Time: 09:30–13:30 

Venue: Grand Ballroom 1, 3rd Floor, East Wing, Sheraton Hsinchu Hotel

Language: English

Agenda: