Core Member Meeting: Enabling Precise Strategies & Effective Collaboration, June 24, 2024
- Date : 2024-09-25
- Source：Heterogeneous Integration and Chiplet System Package Alliance
- Views ：1076
- Event date
- August 28, 2024, 09:00-13:30
- Event Location
- Grand Ballroom 3, 3rd Floor, East Wing, Sheraton Hsinchu Hotel
- Organizer
- Hi-CHIP Alliance
As we enter the second half of 2024, reflecting on the first half, the surge in AI demand has accelerated advancements in computing architectures, driving innovations in AI chips and propelling the semiconductor industry to new heights.
To help our members grasp industry trends and future opportunities, our upcoming third-quarter alliance meeting will feature Arm discussing Trends in AI Chip Computing Architecture, and Yole Group sharing insights on Computing and AI for Robotic Mobility. We look forward to discussing the latest industry trends, challenges, and opportunities together.
We sincerely invite all members to join this meeting to exchange insights, forge partnerships, and advance the semiconductor industry!
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Time |
Session |
|
08:30-09:00 |
Registration |
|
09:00-09:05 |
Opening Speaker: Shih-Chieh Chang, Chairman of Hi-CHIP |
|
09:05-09:35 |
Speech 1 (Including 5-minute Q&A) Topic: Trends in AI Chip Computing Architecture Speaker: Frank Chen, Sr. Director, Arm |
|
09:35-10:05 |
Speech 2 (Including 5-minute Q&A) |
|
10:05-10:35 |
Break |
|
10:35-11:20 |
TWG Report Speakers: •General Convener of TWG 1: Li-Cheng Shen, Senior Director, USI
•General Convener of TWG 2: Johnson Tai, President, Raytek
•General Convener of TWG 3: Yu-Hua Chen, Vice President, Unimicron
|
|
11:20-12:00 |
Discussion Moderator: Wei-Chung Lo, Vice Chairman of Hi-CHIP |
|
12:00-13:30 |
Lunch |
