Heterogeneous Integration and Chiplet System Package Alliance

Advanced packaging has evolved from expensive custom solutions to those ready for more widespread adoption.

When 2.5D and 3D packaging were first conceived, the general consensus was that only the largest semiconductor houses would be able to afford them, but development costs are quickly coming under control. In some cases, these advanced packages actually may turn out to be the lowest-cost options.

For more details, please follow the link below：【3D-ICs May Be The Least-Cost Option】