Heterogeneous Integration and Chiplet System Package Alliance

The open chiplet interconnect protocol faces some formidable challenges, but progress continues.

The integration of multiple dies within a single package increasingly is viewed as the next evolution for extending Moore’s Law, but it also presents myriad challenges — particularly in achieving a universally accepted standard integrating plug-and-play chiplets from different vendors.

For more details, please follow the link below：【UCIe Goes Back To The Drawing Board】