Core Member Meeting, March 27, 2024
- Date : 2024-03-27
- Source：Heterogeneous Integration and Chiplet System Package Alliance
- Views ：133
- Event date
- March 27, 2024, 09:00-13:00
- Event Location
- Grand Ballroom 1, 3rd Floor, East Wing, Sheraton Hsinchu Hotel
- Organizer
- Hi-CHIP Alliance
This meeting aims to discuss our plans for the upcoming year. We are privileged to welcome distinguished speakers, including Jen-Tai Hsu, Vice President of GUC; Shohei Fujishima, Ph.D., of Ajinomoto; and Ms. Cindy Lee, Technology Director of EVG Taiwan.
Through our discussions, we aim to deepen members' understanding of the high-speed interface requirements and market challenges in generative AI computing modules, positioning ourselves ahead in a competitive landscape.
| Time | Session |
| 09:00-09:05 | Opening Speaker: Shih-Chieh Chang, Chairman of Hi-CHIP and General Director of EOSL, ITRI |
| 09:05-09:15 | Secretariat Report Speaker: Jerry Wang, General Secretary of Hi-CHIP and Division Director of EOSL, ITRI |
| 09:15-09:45 | Technical Working Group Report Speaker: General Convener of TWG 1: Li-Cheng Shen, Senior Director, USI General Convener of TWG 2: Johnson Tai, President, Raytek General Convener of TWG 3: Yu-Hua Chen, Vice President, Unimicron |
| 09:45-10:15 | Topic: AI and Advanced Packaging Technology and D2D: UCIe 2.5D vs. UCIe 3D Speaker: Jen-Tai Hsu, VP of IP R&D, GUC |
| 10:15-10:30 | Break |
| 10:30-11:00 | Topic: Novel Insulation Materials for High Performance Computing Applications Speaker: Shohei Fujishima, Ph. D., Ajinomoto |
| 11:00-11:30 | Topic: Future Trend for Ultra Low Temperature Cu/Oxide and Cu/Polymer Hybrid Bonding Speaker: Cindy Lee, Technology Director, EVG Taiwan |
| 11:30-12:00 | Discussion |
| 12:00-13:00 | Lunch |
