Heterogeneous Integration and Chiplet System Package Alliance

Selective deposition could slow the need for additional lithography steps, helping to control costs for advanced-node chips.

Rising lithography costs, shrinking feature sizes, and the need for an alternative to copper are collectively spurring new interest in area-selective deposition. An extension of atomic layer deposition, ASD seeks to build circuit features from the bottom up, without relying on lithography.

For more details, please follow the link below：【Sidestepping Lithography In Chip Manufacturing】