Heterogeneous Integration and Chiplet System Package Alliance

How to ensure that chips and chiplets will work as expected inside a package.

Experts at the Table: Semiconductor Engineering sat down to talk about how to inspect and measure smaller features across large areas in advanced packaging, with Frank Chen, director of applications and product management at Bruker Nano Surfaces & Metrology; John Hoffman, computer vision engineering manager at Nordson Test & Measurement; and Jiangtao Hu, senior technology director at Onto Innovation. What follows are excerpts of that conversation.

For more details, please follow the link below：【Inspection, Metrology Issues In Advanced Packages】