Hi-CHIP 2026 Q2 Core Member Meeting
- Date : 2026-07-06
- Source：Heterogeneous Integration and Chiplet System Package Alliance
- Views ：9
- Event date
- June 18, 2026, 09:30-13:30
- Event Location
- Grand Ballroom 1, 3rd Floor, East Wing, Sheraton Hsinchu Hotel
- Organizer
- Hi-CHIP Alliance
Building on the momentum from our first quarter, this meeting will delve into the latest Advanced Packaging market trends and the critical role of AI-driven Memory technology. We will also touch upon the emerging requirements for Quantum Computing infrastructure, exploring how these converging technologies are shaping the next generation of high-performance computing through advanced back-end solutions.
This is a valuable opportunity to stay updated on critical technical breakthroughs and connect with industry peers across the supply chain.
Meeting Information
Date: Thursday, June 18, 2026
Time: 09:30–13:30 (Registration starts at 09:00)
Venue: Grand Ballroom 1, 3rd Floor, East Wing, Sheraton Hsinchu Hotel
Language: English
Agenda:
|
Time |
Session |
|
09:00-09:30 |
Registration |
|
09:30-09:35 |
Opening Remarks |
|
09:35-10:05 |
Advanced Packaging Market and Technology Trends |
|
10:05-10:35 |
Memory Technology Powering the AI Revolution |
|
10:35-11:05 |
Break |
|
11:05-11:35 |
Quantum packaging and the planning of 12-inch advanced semiconductor back-end pilot line |
|
11:35-11:40 |
Closing Remarks |
|
11:40-13:30 |
Lunch |
