Heterogeneous Integration and Chiplet System Package Alliance

Since our last meeting, we have received numerous requests from members seeking more opportunities for in-depth interaction and collaboration with other members. In response to this feedback, we have organized an executive networking luncheon for alliance members. The event will feature a lecture, a panel discussion, and a luncheon.

We are honored to have Darren Su, Director Product Development Eng at AMD, share his insights on "The Challenges and Opportunities in Building Next-Generation High-Performance Computing Architectures." To further assist our members in formulating more precise market strategies and fostering concrete collaboration, we will host a panel discussion with the conveners of our technical working groups and members. The discussion will focus on two key topics: "The Challenges of Heterogeneous Integration in AI Chips over the Next Three Years" (priority) and "The Timing and Prospects of Silicon Photonics in AI Hardware Computing."

We aim to bring together the leading figures in the semiconductor industry to explore the latest trends, challenges, and opportunities within the sector.