UCIe Chairman's Workshop, October 27, 2023
- Date : 2023-11-01
- Source:Heterogeneous Integration and Chiplet System Package Alliance
- Views :941
- Event date
- October 27, 2023, 13:00-14:45
- Event Location
- Conference Room 3A, Building 51, Zhongxing Campus, ITRI
- Organizer
- Hi-CHIP Alliance / AITA Alliance SIG2
The development of generative AI applications has driven the integration of small chips, becoming the mainstream trend for future semiconductor technological advancements. The communication standards between these small chips have become a significant concern within the semiconductor industry. UCIe, in collaboration with international giants, is spearheading the establishment of related standards, aiming to provide industry interface communication standards and thereby accelerate the integration of the global industry chain.
In the face of the rapid development and transformation of the semiconductor industry propelled by small chip technology, we are honored to invite Dr. Debendra Das Sharma, the Chairman of the UCIe Alliance, an authoritative expert in the semiconductor field, to deliver an exciting lecture at the Industrial Technology Research Institute (ITRI) at this critical juncture.
This lecture is jointly organized by the Hi-CHIP Alliance and the AITA Alliance SIG 2. Through in-depth discussions, we hope to stimulate various innovative ideas and collectively explore more possibilities for the future of the semiconductor industry!
Time | Topic | Speaker |
13:00-13:05 | Opening |
Dr. Wei-Chung(Robert) Lo Vice Chairman of Hi-CHIP Alliance Deputy General Director of EOSL of ITRI |
13:05-13:45 | On-Package Chiplet Innovations with Universal Chiplet Interconnect ExpressTM (UCIeTM): Challenges and Opportunites |
Dr. Debendra Das Sharma Chair, UCIe Consortium Intel Senior Fellow and co-GM Memory and I/O Technologies, Intel Corporation |
13:45-14:45 | Q&A |