Heterogeneous Integration and Chiplet System Package Alliance

The Hi-CHIP Alliance wrapped up 2024 with a successful Year-End Member Meeting, showcasing the latest trends and advancements in the semiconductor industry. This year saw remarkable progress in key areas, including AI, Glass Core, Co-Packaged Optics (CPO), and Fan-Out Panel-Level Packaging (FOPLP), setting the stage for the industry's future growth.

Key Presentations

1. Fan-Out Chip-Last Panel-Level Packaging for Heterogeneous Integration
    Speaker: Curry Lin, Deputy Manager, Unimicron

2. Photonic Integrated Circuits: Industry Insights, Market Trends, and Technological Advances
   Speaker: Martin Vallo, Senior Analyst, Yole Group

3. Co-Packaged Optics for Future Optical Interconnects
   Speaker: Tattee Khayim, General Manager, Fabrinet

Technology Showcases

1. USI: SiP Solutions (Power Tower Module, MS-01 Pro WLAN  Module, Phoenix RF Module)

2. JCU: Acid Copper Plating Processes for Through Silicon and Glass Via

3. GPM: Grinding Technology Solutions

4. UVAT: Glass Core TGV Industry Applications

5. APT: Optimizing Flux Residual Cleaning in Flip-Chip Processes via Underfill Curing in a Pneumatic Environment for AI Chip Production

6. Manz: Achieving >95% Uniformity in Glass Core Production Processes

7. RockCore: Smart Manufacturing AI Edge Accelerator Solutions

8. Unimicron & ITRI: Advanced Hybrid Substrate Packaging

9. Panasonic & ITRI: Crack-Free Full Cut Thin Wafer (Plasma Dicing)

10. ITRI:

    - Wafer Level Fan-out Packaging and Shuttle Service

    - Wafer Level Through Glass Via (TGV)

    - Advanced Panel-level Multi-chip Packaging Electrical Compensation Technology

    - Component allocation technology for system on module (SoM) and system in package (SiP) 

Looking Ahead

The meeting concluded with a preview of the Hi-CHIP Alliance’s 2025 plans, fostering opportunities for collaboration and innovation across the semiconductor ecosystem.

Join the Hi-CHIP Alliance
Connect with leading industry players, explore cutting-edge technologies, and shape the future of semiconductors. Contact us at hichip@itri.org.tw

Let’s advance the semiconductor industry together!