Heterogeneous Integration and Chiplet System Package Alliance

Chipmakers will stall as long as possible, but copper’s days are numbered.

Chipmakers’ focus on new interconnect technology is ramping up as copper’s effectiveness continues to diminish, setting the stage for a significant shift that could improve performance and reduce heat at future nodes and in advanced packages.

For more details, please follow the link below：【Ruthenium Interconnects On Tap】